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Packaging Engineer

Company: Bourns
Location: Riverside
Posted on: May 3, 2021

Job Description:

The Assembly Packaging Engineer will provide project management, package design/development and sustaining support for semiconductor diode, power and surge protection assembly. Responsible for the thermal/mechanical/electrical design, analysis, and development of assembly packages. Provides expertise on packaging performance and specification. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Product Engineering, Quality Assurance and Purchasing regarding material quality and subcontractor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Duties and Accountabilities The Semiconductor Assembly Packaging engineer will be responsible for understanding the basic fundamentals and building blocks of the semiconductor packaging manufacturing process. Provide Semiconductor Assembly expertise Experienced in package design and familiar with Auto CAD. Understanding of Jedec specs and background of Rel Test specs, CSAM, XRay, SEM, etc. Understand assembly package design rules. Optimise package lead frame designs Define and qualify new assembly package flows, driving yield improvement. Resolve technical problems with subcontract assembly sites. Assures the proper, complete engineering documentation package to support successful new product launch or product/process implementation per ISO TS16949 standard or better. Advise design groups on robust cost effective assembly techniques /processes. Assembly technology interface between product, process and test engineering, purchasing and quality. Solves chronic problems (quality, performance and cost) related to assembly processes using new materials, technologies, design, FMEA SPC, DOE or other techniques. Keeps informed on trends and developments in assembly of diode, power and surge protection devices. Interpersonal Skills Highly motivated and excited by self-directed hands-on work. Strong team work ethic Communications Oral: Excellent English Language skills required to communicate instructions and present ideas, concepts, and solutions to colleagues, suppliers, and customers Written: Excellent English language written skills required to issue instructions and present ideas, concepts, and solutions to colleagues and suppliers via email, memos, graphs, charts, etc. Scheduling and Planning Develops and Works to defined schedules Basic Job Requirements Education: Normally, graduation from an accredited three-year college or university with a degree in Engineering, Science or Mathematics required, or equivalent education, training and experience. Training and Experience: At least 5 years progressive engineering experience working in semiconductor assembly packaging. Specific Knowledge and Experience: Knowledge of Diode and surge protection technology with emphasis on semi-conductor protection components. Other Skills:Time management and organizational skills. Capable of managing work and deliverables from others with little supervision. Flexible and able to work in a demanding environment with regular international travel.

Keywords: Bourns, Riverside , Packaging Engineer, Other , Riverside, California

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